February 20, 2018 - 10:00 AM EST
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Air Products Introduces New Flux-free Soldering Technology for Wafer Level Packaging Applications at IPC APEX Expo

LEHIGH VALLEY, Pa., Feb. 20, 2018 /PRNewswire/ -- Air Products (NYSE: APD) will introduce a break-through fluxless soldering technology using electron attachment (EA) technology for wafer level packaging applications at the IPC APEX Expo in San Diego, Calif., from February 27-March 1.

Air Products' patented EA technology uses activated hydrogen at ambient pressure with a starting temperature as low as 100°C to remove metal oxides from electroplated solder bumps on semiconductor wafers and permit reflow of these bumps to obtain the proper shape and size for interconnection onto a package or substrate. 

Expo attendees are invited to stop by Air Products' booth #3604 to learn about the benefits of the company's proprietary EA-based technology. These benefits include enhanced bump reflow quality due to flux induced solder voids and wafer contaminations that naturally disappear; improved productivity from in-line process capability, which reduces or eliminates post wafer cleaning and furnace downtime for cleaning; lower cost of ownership for end users due to reduction or elimination of costs associated with cleaning equipment, cleaning solution, labor work and flux; and fewer environmental issues due to elimination of organic vapors, hazard residues and CO2 emissions.

Air Products has collaborated with Sikama International to offer an electron attachment fluxless reflow system (EAUP1200). The furnace is designed to remove metal oxides from solder bumps on UBM wafers and solder caps from copper pillar wafers via the EA technology. The activated hydrogen produces hydrogen anions, which induces reflow of the solder to a final shape in the absence of traditional flux processes.

In addition to industrial gases for integrated circuit assembly processes, Air Products provides nitrogen reflow, inert nitrogen control systems, wave soldering inerting kits and selective wave soldering for printed circuit board assembly, as well as environmental stress screening.

To learn more about the company's complete portfolio of solutions for the electronics packaging industry, call 800-654-4567 (outside of the U.S. 610-706-4730) or visit airproducts.com/electronicassembly.

About Air Products
Air Products (NYSE: APD) is a world-leading Industrial Gases company in operation for over 75 years. The Company's core industrial gases business provides atmospheric and process gases and related equipment to manufacturing markets, including refining and petrochemical, metals, electronics, and food and beverage. Air Products is also the world's leading supplier of liquefied natural gas process technology and equipment.

The Company had fiscal 2017 sales of $8.2 billion from continuing operations in 50 countries and has a current market capitalization of about $35 billion. Approximately 15,000 passionate, talented and committed employees from a diversity of backgrounds are driven by Air Products' higher purpose to create innovative solutions that benefit the environment, enhance sustainability and address the challenges facing customers, communities and the world. For more information, visit www.airproducts.com.

NOTE: This release may contain forward-looking statements within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management's reasonable expectations and assumptions as of the date of this release regarding important risk factors. Actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors not anticipated by management, including risk factors described in the Company's Form 10K for its fiscal year ended September 30, 2017.

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SOURCE Air Products

Source: PR Newswire (February 20, 2018 - 10:00 AM EST)

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